• Model: BA-127
• Application: Softening & removing resinating I sealing glue of chip BGA IC
• Product name: BGA IC Adhesive Removing Liquid
• Capacity: 20ml(FULL)

BA-127 Chip Encapsulant and Remover

Designed for Precision Circuit Board Chip Encapsulation and Removal, Exclusive Formulation, Chip-Safe, No Heat or Additional Equipment Needed, Enables Fast Chip Repairs

Product Overview:

ba-127 Chip Encapsulant and Remover is specifically formulated for precision circuit board chip encapsulation and removal tasks. With its exclusive formulation, it provides a reliable solution that ensures the safety and integrity of the chips. This product eliminates the need for heat or additional equipment, allowing for efficient and speedy chip repairs.

Product Features:

Exclusive formulation: The ba-127 chip encapsulant and remover features a unique formula that guarantees optimal performance and compatibility with various types of chips.

Chip-safe: This product treats chips with care, preventing any harm or degradation during the encapsulation and removal processes.

No heat or additional equipment required: With ba-127, there's no need for complicated heating procedures or additional machinery. It simplifies the chip repair process, saving time and effort.

Enables fast chip repairs: The efficient formulation and user-friendly application of ba-127 enable swift and effective chip repairs, minimizing downtime and maximizing productivity.

Opt for ba-127 Chip Encapsulant and Remover for your precision circuit board chip encapsulation and removal requirements. With its exclusive formulation, chip-safe properties, absence of heat or additional equipment needs, and ability to facilitate fast chip repairs, it ensures dependable and efficient results.

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